mpx10 rev 12, 01/2007 freescale semiconductor technical data ? freescale semiconductor, in c., 2007. all rights reserved. 10 kpa uncompensated silicon pressure sensors the mpx10 and mpxv10gc series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output ? directly proportional to the applied pressure. th ese standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. compensation techniques are simplified because of the predictability of freescale's single element strain gauge design. figure 1 shows a schematic of the internal circuitry on the stand-alone pressure sensor chip. features ? low cost ? patented silicon shear stress strain gauge design ? ratiometric to supply voltage ? easy to use chip carrier package options ? differential and gauge options ? durable epoxy unibody element or ther moplastic (pps) surface mount package functional description ? air movement control ? environmental control systems ? level indicators ? leak detection ? medical instrumentation ? industrial controls ? pneumatic control systems ? robotics ordering information (1) 1. mpx10 series pressure sensors are avai lable in differential and gauge configurations. devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. device type options case no. order number device marking small outline package (mpxv10g series) ported elements rails 482a mpxv10gc6u mpxv10g tape and reel 482a mpxv10gc6t1 mpxv10g rails 482c mpxv10gc7u mpxv10g unibody package (mpx10 series) basic element differential 344 mpx10d mpx10d ported elements differential 344c mpx10dp mpx10dp gauge 344b mpx10gp mpx10gp gauge 344e mpx10gs mpx10d mpx10 mpxv10gc series uncompensated pressure sensor 0 to 10 kpa (0?1.45 psi) 35 mv full scale span (typical) small outline package pin numbers 1 gnd 5 n/c 2 +v out 6 n/c 3 v s 7 n/c 4 ?v out 8 n/c note: pin 1 is noted by the notch in the lead. small outline packages mpxv10gc6u case 482a-01 mpxv10gc7u case 482c-03 unibody package pin numbers 1 gnd 3 v s 2 +v out 4 ?v out note: pin 1 is noted by the notch in the lead. mpx10dp case 344c-01 mpx10d case 344-15 mpx10gp case 344b-01 mpx10gs case 344e-01 unibody packages
mpx10 sensors 2 freescale semiconductor figure 1. uncompensated pressure sensor schematic voltage output versus applied differential pressure the output voltage of the diff erential or gauge sensor increases with increasing pressure applied to the pressure side (p1) relative to the vacuum side (p2). similarly, output voltage increases as increasing vacuum is applied to the vacuum side (p2) relative to the pressure side (p1). 1 2 3 4 gnd +v out ?v out +v s sensing element table 1. maximum ratings (1) 1. exposure beyond the specified limits may c ause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa burst pressure (p > p2) p burst 100 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c
mpx10 sensors freescale semiconductor 3 table 2. operating characteristics (v s = 3.0 vdc, t a = 25c unless otherwise noted, p1 > p2) characteristic symbol min typ max units differential pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op 0 ? 10 kpa supply voltage (2) 2. device is ratiometric within this spec ified excitation range. operating the devic e above the specified excitation range may i nduce additional error due to device self-heating. v s ? 3.0 6.0 v dc supply current i o ? 6.0 ? madc full scale span (3) 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. v fss 20 35 50 mv offset (4) 4. offset (voff) is defined as the output voltage at the minimum rated pressure. v off 0 20 35 mv sensitivity ? v/ ? ? 3.5 ? mv/kpa linearity (5) 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis:output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure with the specified range, when this pressure is cycled to and from the mi nimum or maximum rated pressure at 25c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85c, relative to 25c. ? tcoffset: output deviation with minimum ra ted pressure applied, over the temperature range of 0 to 85c, relative to 25c. ? tcr: z in deviation with minimum rated pressure applied, over the temperature range of -40c to 125c, relative to 25c. ? ?1.0 ? 1.0 %v fss pressure hysteresis (5) (0 to 10 kpa) ? ? 0.1 ? %v fss temperature hysteresis (5) (?40c to +125c) ? ? 0.5 ? %v fss temperature coefficient of full scale span (5) tcv fss ?0.22 ? ?0.16 %v fss /c temperature coefficient of offset (5) tcv off ? 15 ? v/c temperature coefficient of resistance (5) tcr 0.28 ? 0.34 %/z in /c input impedance z in 400 ? 550 ? output impedance z out 750 ? 1250 ? response time (6) (10% to 90%) 6. response time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. t r ? 1.0 ? ms warm-up time (7) 7. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure is stabi lized. ? ? 20 ? ms offset stability (8) 8. offset stability is the product?s output deviation when subjected to 1000 hours of pu lsed pressure, temper ature cycling with bias test. ? ? 0.5 ? %v fss
mpx10 sensors 4 freescale semiconductor temperature compensation figure 2 shows the typical output characteristics of the mpx10 and mpxv10gc series over temperature. because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. however, the properties of the strain gauge itself are temper ature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the mpx2010d series sensor. several approaches to external temperature compensation over both ?40 to +125 c and 0 to +80 c ranges are presented in application note an840. linearity linearity refers to how well a transducer?s output follows the equation: v out = v off + sensitivity x p over the operating pressure range ( figure 3 ). there are two basic methods for calculating nonlinearity: 1) end point straight line fit or 2) a least squares best line fit. while a least squares fit gives the ?best case? linearity error (l ower numerical value), the calculations required are burdensome. conversely, an end point fit will give the ?worst case? error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. freescale?s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. output versus pressure differential figure 3. linearity specification comparison pressure differential output (mvdc) 80 70 60 50 40 30 20 10 0 0 0.3 2.0 0.6 4.0 0.9 6.0 1.2 8.0 10 1.5 psi kpa span range (typ) offset (typ) v s = 3 v dc p1 > p2 -40 c +25 c +125 c linearity actual theoretical offset (v off ) max p op output (mvdc) pressure (kpa) 70 60 50 40 30 20 10 0 0 span (v fss )
mpx10 sensors freescale semiconductor 5 figure 4. unibody package ? cross- sectional diagram (not to scale) figure 4 illustrates the differential or gauge configuration in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the mpx10 and mpxv10gc series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long term reliability. contact the factory for information regarding media compatibility in your application. pressure (p1)/vacuum (p2) side identification table freescale designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the freescale pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the following table. silicone die coat die p1 p2 wire bond lead frame rtv die bond epoxy case stainless steel metal cover part number case type pressure (p1) side identifier mpx10d 344 stainless steep cap mpx10dp 344c side with part marking mpx10gp 344b side with port attached mpx10gs 344e side with port attached mpxv10gc6u 482a side with part marking mpxv10gc7u 482c side with part marking
package dimensions case 344b-01 issue b unibody package case 344-15 issue aa unibody package notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. d 4 pl f u h l port #1 positive pressure (p1) pin 1 -a- -q- s k g -p- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t 12 34 seating plane b n r c j -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.305 0.325 7.75 8.26 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.230 0.250 5.84 6.35 s u 0.910 bsc 23.11 bsc 0.220 0.240 5.59 6.10 notes: 1. 2. 3. dimensioning and tolerancing per asme y14.5m, 1994. controlling dimension: inch. dimension -a- is inclusive of the mold stop ring. mold stop ring not to exceed 16.00 (0.630). m a m 0.136 (0.005) t 1234 pin 1 r n l g f d 4 pl seating plane -t- c m j b -a- dambar trim zone: f this is included within dim. "f" 8 pl 1 23 4 y z style 1: pin 1. ground 2. + output 3. + supply 4. - output style 2: pin 1. v cc 2. - supply 3. + supply 4. ground style 3: pin 1. gnd 2. -vout 3. vs 4. +vout dim min max min max millimeters inches a 0.595 0.630 15.11 16.00 b 0.514 0.534 13.06 13.56 c 0.200 0.220 5.08 5.59 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.40 l 0.695 0.725 17.65 18.42 m 30? nom 30? nom n 0.475 0.495 12.07 12.57 r 0.430 0.450 10.92 11.43 y 0.048 0.052 1.22 1.32 z 0.106 0.118 2.68 3.00 mpx10 sensors 6 freescale semiconductor
package dimensions case 344c-01 issue b unibody package case 344e-01 issue b unibody package notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. port #2 port #1 port #2 vacuum (p2) (p1) seating plane seating plane k s w h l u f g d 4 pl port #1 positive pressure -q- 12 4 3 pin 1 -p- -t- -t- s q m 0.25 (0.010) t s s m 0.13 (0.005) q s t b n j c v r -a- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 1.145 1.175 29.08 29.85 b 0.685 0.715 17.40 18.16 c 0.405 0.435 10.29 11.05 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc h 0.182 0.194 4.62 4.93 j 0.014 0.016 0.36 0.41 k 0.695 0.725 17.65 18.42 l 0.290 0.300 7.37 7.62 n 0.420 0.440 10.67 11.18 p 0.153 0.159 3.89 4.04 q 0.153 0.159 3.89 4.04 r 0.063 0.083 1.60 2.11 s u 0.910 bsc 23.11 bsc v 0.248 0.278 6.30 7.06 w 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 notes: 1. 2. dimensioning and tolerancing per ansi y14.5m, 1982. controlling dimension: inch. s back side vacuum (p2) pin 1 4 pl d port #1 positive pressure (p1) 4 seating plane 32 1 k a g f m b m 0.13 (0.005) t c n r v j -b- -t- style 1: pin 1. ground 2. + output 3. + supply 4. - output dim min max min max millimeters inches a 0.690 0.720 17.53 18.28 b 0.245 0.255 6.22 6.48 c 0.780 0.820 19.81 20.82 d 0.016 0.020 0.41 0.51 f 0.048 0.064 1.22 1.63 g 0.100 bsc 2.54 bsc j 0.014 0.016 0.36 0.41 k 0.345 0.375 8.76 9.53 n 0.300 0.310 7.62 7.87 r 0.178 0.186 4.52 4.72 s v 0.182 0.194 4.62 4.93 0.220 0.240 5.59 6.10 mpx10 sensors freescale semiconductor 7
package dimensions case 482a-01 issue a small outline package case 482c-03 issue b small outline package mpx10 sensors 8 freescale semiconductor
mpx10 rev. 12 01/2007 how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor hong kong ltd. technical information center 2 dai king street tai po industrial estate tai po, n.t., hong kong +800 2666 8080 support.asia@freescale.com for literature requests only: freescale semiconductor lite rature distribution center p.o. box 5405 denver, colorado 80217 1-800-441-2447 or 303-675-2140 fax: 303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the application or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data s heets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconductor products for any such unintended or unauthorized application, buyer shall indemni fy and hold freescale semiconductor and its officers, employees, subsidiaries, affili ates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale? and the freescale logo are trademarks of freescale semiconductor, inc. all other product or service names are the property of their respective owners. ? freescale semiconductor, inc. 2007. all rights reserved.
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